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| Infrarot-LED Infrared-LED SFH 4281 Wesentliche Merkmale * * * * Emissionswellenlange 880nm Homogene Abstrahlcharakteristik IR Reflow und TTW Loten geeignet Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020A Features * * * * Typical peak wavelength 880nm Homogeneous Radiation Pattern Suitable for IR reflow and TTW soldering Moisture Sensitivity Level 2 according to JEDEC Standard J-STD-020A Anwendungen * Miniaturlichtschranken fur Gleich- und Wechsellichtbetrieb * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme * IR-Freiraumubertragung Typ Type SFH 4281 1) Applications * * * * * * * Miniature photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission Bestellnummer Ordering Code Q62702P5000 Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1), Ie (mW/sr) -P 4 ... 8 -Q 6.3 ... 12.5 gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2003-03-27 1 SFH 4281 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlastrom Forward current Stostrom, = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 100 2.5 180 450 Einheit Unit C V mA A mW K/W Top; Tstg VR IF IFSM Ptot Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJC Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Symbol Symbol peak 200 K/W Wert Value 880 Einheit Unit nm 80 nm 60 0.09 0.3 x 0.3 Grad deg. mm2 mm A LxB LxW 2003-03-27 2 SFH 4281 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat, Capacitance VR = 0 V, f = 1 MHz Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom, Reverse current VR = 5 V Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e, Symbol Symbol Wert Value 0.5 Einheit Unit s tr, tf Co 15 pF VF VF IR 1.5 ( 1.8) 3.0 ( 3.8) 0.01 ( 1) V V A e 23 mW TCI - 0.5 %/K IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TCV TC -2 + 0.25 mV/K nm/K 2003-03-27 3 SFH 4281 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol Werte Values -P Ie min Ie max 4 8 -Q 6.3 12.5 mW/sr mW/sr Einheit Unit Ie typ. 50 60 mW/sr 2003-03-27 4 SFH 4281 Relative Spectral Emission Irel = f () 100 rel % 80 OHR00877 Radiant Intensity e = f (IF) e 100 mA OHR00878 Single pulse, tp = 20 s 10 2 e (100mA) 10 1 Max. Permissible Forward Current IF = f (TA) 120 OHR00883 e F mA 100 60 10 0 80 R thjA = 450 K/W 60 40 10 -1 40 20 10 -2 20 0 750 10 -3 800 850 900 950 nm 1000 10 0 10 1 10 2 10 3 mA 10 4 F 0 0 20 40 60 80 100 C 120 TA IF = f (VF), single pulse, tp = 20 s 10 1 OHR00881 Forward Current Permissible Pulse Handling Capability IF = f (tp), TA = 25 C duty cycle D = Parameter 10 4 mA OHR00886 F A F 10 0 D = 0.005 0.01 0.02 0.05 10 3 0.1 0.2 10 -1 0.5 10 2 10 -2 DC tp D= 10 -3 tp T F T 0 1 2 3 4 5 6 V VF 8 10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp Radiation Characteristics Srel = f () 40 30 20 10 0 OHL01660 1.0 50 0.8 0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0 2003-03-27 5 SFH 4281 Mazeichnung Package Outlines 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 1.7 (0.067) 1.0 (0.039) 0.9 (0.035) 0.3 (0.012) max 2.1 (0.083) (2.4 (0.094)) 0.3 (0.012) min 6 3.4 (0.134) 3.0 (0.118) 41 0...0.1 (0.004) 0.6 (0.024) 0.4 (0.016) GPLY6899 Cathode marking Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2003-03-27 5.4 (0.213) 5.0 (0.197) SFH 4281 Lothinweise Soldering Conditions Bauform Types Tauch-, Schwall- und Schlepplotung Dip, Wave and Drag Soldering Lotbadtemperatur Maximal zulassige Lotzeit Max. Perm. Soldering Time 10 s Abstand Lotstelle - Gehause Distance between Solder Joint and Case - Reflowlotung Reflow Soldering Lotzonentemperatur Maximale Durchlaufzeit Temperature of the Soldering Bath TOPLED RG 260 C Temperature of Soldering Zone 245 C Max. Transit Time 10 s Zusatzliche Informationen uber allgemeine Lotbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us. Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2003-03-27 7 |
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